Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages

被引：12

作者：

Yi, S ^{[1
]}

Sze, KY

机构：

[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639678, Singapore

[2] Univ Hong Kong, Dept Mech Engn, Hong Kong, Hong Kong

来源：

FINITE ELEMENTS IN ANALYSIS AND DESIGN | 1998年 / 30卷 / 1-2期

关键词：

D O I：

10.1016/S0168-874X(98)00027-4

中图分类号：

O29 [应用数学];

学科分类号：

070104 ;

摘要：

In this study, the finite element analysis of moisture absorption and residual stresses in plastic encapsulated IC packages is presented. During the moisture soaking test, moisture distributions in plastic encapsulated IC packages are evaluated by solving the diffusion equations. Thin LOC TSOP packages in various moisture soaking conditions are considered. The effects of temperature and humidity conditions on moisture distributions in TSOP packages are investigated in order to assess product reliability. Hygro-thermally induced deformations and stresses in plastic IC packages are also evaluated. (C) 1998 Elsevier Science B.V. All rights reserved.

引用

页码：65 / 79

页数：15

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