Accurate and Efficient Algorithm for Computing Structure Functions From the Spatial Distribution of Thermal Properties in Electronic Devices

被引：7

作者：

Codecasa, Lorenzo ^{[1
]}

d'Alessandro, Vincenzo ^{[2
]}

Catalano, Antonio Pio ^{[2
]}

Scognamillo, Ciro ^{[2
]}

D'Amore, Dario ^{[1
]}

Aufinger, Klaus ^{[3
]}

机构：

[1] Politecn Milan, Dept Elect Informat & Bioengn, I-20133 Milan, Italy

[2] Univ Federico II, Dept Elect Engn & Informat Technol, I-80125 Naples, Italy

[3] Infineon Technol AG, D-85579 Neubiberg, Germany

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 2021年 / 68卷 / 11期

关键词：

Heating systems; Thermal conductivity; Power transmission lines; Thermal resistance; Graphical models; Distribution functions; Temperature measurement; Heterojunction bipolar transistor (HBT); multi-directional heat flow; self-heating (SH); silicon germanium (SiGe); structure function; transmission line; IDENTIFICATION; BEHAVIOR; LAYOUT; IMPACT;

D O I：

10.1109/TED.2021.3073647

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An accurate and efficient algorithm is presented, which allows deriving the structure function of a discretized 3-D heat conduction problem. In this approach, the partial thermal conductances and capacitances in the structure function are computed in terms of weighted spatial averages of thermal resistivity and volumetric heat capacity. As a result, the exact influence of all materials and geometric details on each part of the structure function is determined. The approach is validated on a state-of-the-art SiGe heterojunction bipolar transistor (HBT) for high-frequency applications.

引用

页码：5386 / 5393

页数：8

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