共 10 条
- [1] Advances in thermal management materials for electronic applications [J]. JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1998, 50 (06): : 46 - 46
- [2] Lostetter A., 1998, ADV MICROELECTRONICS, V25, P25
- [4] Moores K.A., 2001, FUTURE CIRCUITS INT, V7, P45
- [5] SHARP GR, 1990, AIAA900783 NASA
- [6] SOMMER JL, 1997, DAAH0196CR231 DARPA
- [8] WEEKS JK, 1998, Patent No. 5834115
- [9] Zweben C, 2005, ADV MATER PROCESS, V163, P33
- [10] Advances in photonics thermal management and packaging materials [J]. PHOTONICS PACKAGING, INTEGRATION, AND INTERCONNECTS VIII, 2008, 6899