Optical Proximity Communication.

被引：1

作者：

Shubin, Ivan ^{[1
]}

Cunningham, John E. ^{[1
]}

Zheng, Xuezhe ^{[1
]}

Simons, John ^{[1
]}

Feng, Dazeng ^{[2
]}

Liang, Hong ^{[2
]}

Kung, Cheng-Chih ^{[2
]}

Asghari, Mehdi ^{[2
]}

Krishnamoorthy, Ashok V. ^{[1
]}

机构：

[1] Sun Microsyst Microelect Phys Sci Ctr, San Diego, CA 92121 USA

[2] Kotura Inc, Monterey, CA 91754 USA

来源：

OPTOELECTRONIC INTEGRATED CIRCUITS XI | 2009年 / 7219卷

关键词：

Optical communication and coupling and performance; waveguide couplers; silicon on insulator technology; silicon micromachining; advanced packaging; FABRICATION; CIRCUIT; MIRRORS;

D O I：

10.1117/12.813415

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We review 10Gb/sec Optical Proximity Communication realized with packaged chips that carry SOI optical waveguides and reflecting mirrors micromachined in silicon. The high precision chip to chip alignment and placement was enabled by a new packaging concept based on the co-integration of pyramidal pit features defined by anisotropic silicon etch and matching high precision micro-spheres. We support this novel packaging approach with measured optical transmission data and discuss the extent of it towards other applications of Proximity Communication.

引用

页数：8

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