Investigation on Reliability of Low-Ag Lead-free Solder Alloy

被引：0

作者：

Hu, Yating ^{[1
]}

An, Bing ^{[1
]}

Zhang, Yi ^{[1
]}

Wu, Yiping ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, Inst Mat Sci & Engn, Wuhan 430074, Peoples R China

来源：

2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2013年

关键词：

SnAgCu; lead-free; wettability; microstructure; reliability;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The main objective of this paper is to investigate the reliability of low-Ag lead-free solder alloy. The wettability, mechanical property and microstructure of Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. Experimental studies have shown that the wetting property of low-Ag lead-free solder alloy SAC105 remains to be improved and mechanical strength is lower to SAC305, but its anti-drop and anti-shock performance are outstanding. Though the wetting property of SAC105 is inferior to SAC305, the melting point and wettability of SAC105 can meet the actual reliability requirements of products. Matched with appropriate process, low-Ag lead-free solder can also form reliable solder joints to meet the reliability standards in industrial production.

引用

页码：334 / 337

页数：4

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