Review on laser-induced etching processing technology for transparent hard and brittle materials

被引：33

作者：

Chen, Jialin ^{[1
,2
]}

Lu, Xizhao ^{[3
]}

Wen, Qiuling ^{[1
,2
]}

Jiang, Feng ^{[1
,2
]}

Lu, Jing ^{[1
]}

Lei, Dajiang ^{[4
]}

Pan, Yongcheng ^{[4
]}

机构：

[1] Natl Huaqiao Univ, Inst Mfg Engn, Xiamen 361021, Peoples R China

[2] Fujian Engn Res Ctr Intelligent Mfg Brittle Mat, Xiamen 361021, Peoples R China

[3] Natl Huaqiao Univ, Coll Mech Engn & Automat, Xiamen 361021, Peoples R China

[4] China Acad Engn Phys CAEP, Inst Machinery Mfg Technol, Chengdu 610200, Peoples R China

来源：

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | 2021年 / 117卷 / 9-10期

基金：

中国国家自然科学基金;

关键词：

Laser-induced etching processing technology; Transparent hard and brittle materials; Micro; nano-fabrication; PLASMA-ASSISTED ABLATION; SELECTIVE METALLIZATION; INDUCED BREAKDOWN; FUSED QUARTZ; GLASS; SAPPHIRE; FABRICATION; QUALITY; LIPAA; SPECTROSCOPY;

D O I：

10.1007/s00170-021-07853-2

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The high-efficiency processing and the high geometrical precision requirements on the transparent hard-brittle optoelectrical materials are attractive to the modern industrial's interest. Laser-induced related ablation/etching technology is proved to be effective processing for micro/nanofabrication of the transparent hard and brittle materials, due to its unique advantages of mechanical micro-machining with controllable thermal damage. There are some influencing factors like laser duration, target-to-substrate distance (work distance), target materials (absorption resolution), laser fluence, and circumstance (pressure, air, resolution) which were discussed in this review. The processing qualities in various methods were compared and described in this review. The new development of laser-induced related ablation/etching and related advanced technologies is introduced at the end of this review.

引用

页码：2545 / 2564

页数：20

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