High-temperature creep and hardness of eutectic 80Au/20Sn solder

被引：113

作者：

Liu, Y. C. ^{[1
]}

Teo, J. W. R. ^{[1
]}

Tung, S. K. ^{[1
]}

Lam, K. H. ^{[2
]}

机构：

[1] Singapore Inst Mfg Technol, Singapore 638075, Singapore

[2] Natl Univ Singapore, Singapore 119260, Singapore

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2008年 / 448卷 / 1-2期

关键词：

800Au/20Sn solder; hardness; creep; high-temperature;

D O I：

10.1016/j.jallcom.2006.12.142

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Eutectic 80Au/20Sn solder is widely used for device packaging in optoelectronic and high power electronic industries. The knowledge of thermomechanical properties of the solder is critical for design and application. In this piece of work, Berkovich depth-sensing indentation test has been used to study the effect of temperature on the hardness and the creep behavior of the 80Au/20Sn solder alloy at temperatures ranging from 25 degrees C to 200 degrees C. The results showed that the hardness of eutectic 80Au/20Sn solder decreased as temperature increased. The change of hardness with temperature in the range from 25 degrees C to 150 degrees C could be considered as linear and a temperature coefficient of hardness of -1. 1 X 10(-2) GPa/degrees C could be estimated; thereafter the change of hardness tapers off as the temperature increases to 200 degrees C. On the other hand, the creep penetration and creep strain rate increased and its associated stress exponent decreased with temperature, which resulted in large plastic deformation during indentation. (C) 2007 Elsevier B.V. All rights reserved.

引用

页码：340 / 343

页数：4

共 18 条

[1]

ASHBY MF, 1980, ENG MAT 1 INTRO PROP, P160

[2] High-temperature nanoindentation testing of fused silica and other materials [J].

Beake, BD ;

Smith, JF .

PHILOSOPHICAL MAGAZINE A-PHYSICS OF CONDENSED MATTER STRUCTURE DEFECTS AND MECHANICAL PROPERTIES, 2002, 82 (10) :2179-2186

[3]

BOLTON W, 1998, ENG MAT TECHNOLOGY, P435

[4] Nanoindentation measurements on Cu-Sn and Ag-Sn intermetallics formed in Pb-free solder joints [J].

Chromik, RR ;

Vinci, RP ;

Allen, SL ;

Notis, MR .

JOURNAL OF MATERIALS RESEARCH, 2003, 18 (09) :2251-2261

[5] Cooling rate in diode laser bonding [J].

Fritz, MA ;

Cassidy, DT .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (01) :147-154

[6] DEFORMATION OF PB-SN EUTECTIC ALLOYS AT RELATIVELY HIGH-STRAIN RATES [J].

GRIVAS, D ;

MURTY, KL ;

MORRIS, JW .

ACTA METALLURGICA, 1979, 27 (05) :731-737

[7] Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications [J].

Ivey, DG .

MICRON, 1998, 29 (04) :281-287

[8] Comparison between epi-down and epi-up bonded high-power single-mode 980-nm semiconductor lasers [J].

Liu, XS ;

Hu, MH ;

Nguyen, HK ;

Caneau, CG ;

Rasmussen, MH ;

Davis, RW ;

Zah, CE .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (04) :640-646

[9] Rate-dependent indentation hardness of a power-law creep solder alloy [J].

Ma, X ;

Yoshida, F .

APPLIED PHYSICS LETTERS, 2003, 82 (02) :188-190

[10] AU-SN ALLOY PHASE-DIAGRAM AND PROPERTIES RELATED TO ITS USE AS A BONDING MEDIUM [J].

MATIJASEVIC, GS ;

LEE, CC ;

WANG, CY .

THIN SOLID FILMS, 1993, 223 (02) :276-287

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