Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz

被引：2

作者：

Sepaintner, Felix ^{[1
]}

Schmalzbauer, Michael ^{[2
]}

Loebbicke, Kai ^{[2
]}

Jakob, Johannes ^{[1
]}

Scharl, Andreas ^{[1
]}

Roehrl, Franz ^{[2
]}

Sammer, Roman ^{[2
]}

Bogner, Werner ^{[1
]}

Zorn, Stefan ^{[1
,2
]}

机构：

[1] Deggendorf Inst Technol DIT, D-94469 Deggendorf, Germany

[2] Rohde & Schwarz GmbH & Co KG, D-94244 Teisnach, Germany

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2021年 / 11卷 / 12期

关键词：

Additive manufacturing; Ag nanoparticle ink; electroless plating; inkjet printing; low-cost printed circuit board (PCB) substrate; millimeter wave filters; plasma pretreatment; printed electronics; surface roughness; ANTENNAS;

D O I：

10.1109/TCPMT.2021.3118720

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Usually, the printed circuit board industry has to use special subtractive manufacturing methods, if small line and space dimensions down to 50 mu m are desired. This drastically raises production effort and costs. In this article, a method is shown as to how the inkjet technology can be used to produce passive RF structures with minimum line and space dimensions of 25 mu m. For the first time, this is possible over complete panels of low-cost printed circuit board (PCB) substrates, which have a relatively high surface roughness compared to ceramic or glass carriers. To ensure process reliability, printed lines must also be plated with an additional electroless copper layer to overcome the surface roughness with conductive layers and to lower insertion loss in the two-digit GHz range. Additionally, a surface impedance model is developed, which allows broadband first time right simulations. Finally, additively produced, passive RF filters are compared to their subtractive counterparts to show their benefits regarding production costs and electrical performance up to 80 GHz.

引用

页码：2077 / 2088

页数：12

共 26 条

[1] Fabrication of Copper Electrode on Flexible Substrate Through Ag+-Based Inkjet Printing and Rapid Electroless Metallization [J].