A physics-based electromigration reliability model for interconnects lifetime prediction

被引：0
|
作者：
Cai, Linlin [1 ]
Chen, Wangyong [1 ]
Kang, Jinfeng [1 ]
Du, Gang [1 ]
Liu, Xiaoyan [1 ]
Zhang, Xing [1 ]
机构：
[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
来源：
SCIENCE CHINA-INFORMATION SCIENCES | 2021年 / 64卷 / 11期
基金：
中国国家自然科学基金;
关键词：
D O I：
10.1007/s11432-020-3140-4
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页数：2
相关论文
共 50 条
  • [1] A physics-based electromigration reliability model for interconnects lifetime prediction
    Linlin Cai
    Wangyong Chen
    Jinfeng Kang
    Gang Du
    Xiaoyan Liu
    Xing Zhang
    Science China Information Sciences, 2021, 64
  • [2] A physics-based electromigration reliability model for interconnects lifetime prediction
    Linlin CAI
    Wangyong CHEN
    Jinfeng KANG
    Gang DU
    Xiaoyan LIU
    Xing ZHANG
    Science China(Information Sciences), 2021, 64 (11) : 257 - 258
  • [3] Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects
    Zhao, Wen-Sheng
    Zhang, Rui
    Wang, Da-Wei
    MICROMACHINES, 2022, 13 (06)
  • [4] Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model
    Zahedmanesh, Houman
    Pedreira, Olalla Varela
    Tokei, Zsolt
    Croes, Kristof
    JOURNAL OF APPLIED PHYSICS, 2019, 126 (05)
  • [5] Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models
    Cook, Chase
    Sadiqbatcha, Sheriff
    Sun, Zeyu
    Tan, Sheldon X. -D.
    15TH INTERNATIONAL CONFERENCE ON SYNTHESIS, MODELING, ANALYSIS AND SIMULATION METHODS AND APPLICATIONS TO CIRCUIT DESIGN (SMACD 2018), 2018, : 5 - 8
  • [6] Reliability based hardware Trojan design using physics-based electromigration models
    Cook, Chase
    Sadiqbatcha, Sheriff
    Sun, Zeyu
    Tan, Sheldon X. -D.
    INTEGRATION-THE VLSI JOURNAL, 2019, 66 : 9 - 15
  • [7] Variation-aware physics-based electromigration modeling and experimental calibration for VLSI interconnects
    Nair, Sarath Mohanachandran
    Bishnoi, Rajendra
    Tahoori, Mehdi B.
    Zahedmanesh, Houman
    Croes, Kristof
    Garello, Kevin
    Kar, Gouri Sankar
    Catthoor, Francky
    2019 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2019,
  • [8] Physics-Based Model for Understanding Electromigration-Induced Cavity Evolution in Advanced Narrow Line Copper Interconnects
    Wang, Shizhao
    Cheng, Chunmin
    Liu, Tianjian
    Zhang, Hehui
    Xue, Lianghao
    Sun, Yameng
    Han, Xu
    Liu, Sheng
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (09) : 5123 - 5129
  • [9] Back stress model on electromigration lifetime prediction in short length copper interconnects
    Cheng, Yi-Lung
    Lee, S. Y.
    Chiu, C. C.
    Wu, Kenneth
    2008 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 46TH ANNUAL, 2008, : 685 - 686
  • [10] Physics-based Electromigration Modeling and Assessment for Multi-Segment Interconnects in Power Grid Networks
    Wang, Xiaoyi
    Wang, Hongyu
    He, Jian
    Tan, Sheldon X. -D.
    Cai, Yici
    Yang, Shengqi
    PROCEEDINGS OF THE 2017 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE), 2017, : 1727 - 1732
12345