Effect of curing temperature on the adhesion strength of polyamideimide/copper joints

被引：12

作者：

Cho, JH

Kong, DI

Park, CE ^{[1
]}

Jin, MY

机构：

[1] Pohang Univ Sci & Technol, Polymer Res Inst, Dept Chem Engn, Pohang 790784, South Korea

[2] Korea Res Inst Chem Technol, Adv Polymer Div, Taejon 305606, South Korea

来源：

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | 1998年 / 12卷 / 05期

关键词：

polyamideimide (PAI); copper; adhesion strength; thermal stress; copper oxide;

D O I：

10.1163/156856198X00191

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

The adhesion strength of polyamideimide (PAI)/copper joints was investigated as a function of the curing temperature and time. The adhesion strength decreased as the thermal stress increased with the increase of both curing temperature and time. The effects of copper oxide formed by thermal treatment and alkaline treatment on the adhesion strength of PAI/copper joints were examined. The adhesion strength decreased with thermally oxidized copper and increased with alkali-oxidized copper. The locus of failure of PAI/copper joints was also studied by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). The locus of failure appears to be partially cohesive in both PAI and copper oxide.

引用

页码：507 / 521

页数：15

共 20 条

[1] STRESS IN CHEMICAL-VAPOR-DEPOSITED SIO2 AND PLASMA-SINX FILMS ON GAAS AND SI [J].