Analysis and design of current probe transition from grounded coplanar to substrate integrated rectangular waveguides

被引:105
作者
Deslandes, D [1 ]
Wu, K [1 ]
机构
[1] Ecole Polytech, Dept Genie Elect, Polygrames Res Ctr, Montreal, PQ H3V 1A2, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
coplanar waveguides (CPWs); modeling; substrate integrated rectangular waveguides (SIRWs); transition;
D O I
10.1109/TMTT.2005.852778
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The transition between a grounded coplanar waveguide (GCPW) and a substrate integrated rectangular waveguide (SIRW) is investigated in this paper. The proposed scheme makes use of a current probe to transfer power between the two dissimilar transmission lines. A computer-aided-design-oriented analytical model is developed in order to optimize the geometrical dimensions of the transition. By using the GCPW instead of the microstrip line to interface the SIRW, substrate thickness can be increased without incurring a penalty due to transmission loss. Therefore, it is possible to achieve higher Q components. Experiments at 28 GHz show that an effective bandwidth of 10% can easily be obtained. The insertion loss is less than 0.73 dB over the bandwidth of interest.
引用
收藏
页码:2487 / 2494
页数:8
相关论文
共 22 条
[1]   DESIGN OF SIMPLE BROAD-BAND WAVE-GUIDE-TO-COAXIAL-LINE JUNCTIONS [J].
COHN, SB .
PROCEEDINGS OF THE INSTITUTE OF RADIO ENGINEERS, 1947, 35 (09) :920-926
[2]   Integrated microstrip and rectangular waveguide in planar form [J].
Deslandes, D ;
Wu, K .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2001, 11 (02) :68-70
[3]  
Deslandes D, 2001, IEEE MTT-S, P619, DOI 10.1109/MWSYM.2001.966971
[4]  
Deslandes D., 2002, EUR MICR C 23 27 SEP, P881
[5]   COPLANAR WAVE-GUIDES FOR MMIC APPLICATIONS - EFFECT OF UPPER SHIELDING, CONDUCTOR BACKING, FINITE-EXTENT GROUND PLANES, AND LINE-TO-LINE COUPLING [J].
GHIONE, G ;
NALDI, CU .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1987, 35 (03) :260-267
[6]   On the use of vias in conductor-backed coplanar circuits [J].
Haydl, WH .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2002, 50 (06) :1571-1577
[7]   A high-Q reconfigurable planar EBG cavity resonator [J].
Hill, MJ ;
Ziolkowski, RW ;
Papapolymerou, J .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2001, 11 (06) :255-257
[8]   An integrated LTCC laminated waveguide-to-microstrip line T-junction [J].
Huang, Y ;
Wu, KL ;
Ehlert, M .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2003, 13 (08) :338-339
[9]   A broad-band LTCC integrated transition of laminated waveguide to air-filled waveguide for millimeter-wave applications [J].
Huang, Y ;
Wu, KL .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (05) :1613-1617
[10]  
Ito M, 2001, IEEE MTT S INT MICR, P1597, DOI 10.1109/MWSYM.2001.967209