Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys

被引:17
作者
Park, JY [1 ]
Kim, CU
Carper, T
Puligandla, V
机构
[1] Univ Texas, Dept Mat Sci & Engn, Arlington, TX 76019 USA
[2] Nokia Mobile Phones Inc, Res & Technol Access, Irving, TX 75039 USA
关键词
lead-free solder; Sn-Ag-Cu; differential cooling method; phase equilibria;
D O I
10.1007/s11664-003-0026-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper is a study of the phase equilibria of the Sn-3.8Ag-0.7Cu alloy investigated by a differential cooling method. The difficulty in assessing phase equilibria of the Sn-Ag-Cu (SAC) system because of the insufficient resolution of conventional characterization techniques is solved by inducing preferential growth of a solid phase in a melt by holding the alloy at the solid-liquid phase-equilibrium field. Application of the technique to Sn-3.8Ag-0.7Cu with varying holding temperatures yielded results that the alloy is slightly off eutectic composition. The phase-formation sequence of the alloy during solidification was found to be Ag3Sn, beta-Sn, and finally the ternary eutectic microstructure.
引用
收藏
页码:1297 / 1302
页数:6
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