Effect of PIII on the Adhesion Behavior of Epoxy Molding Compound-Nickel Interface

被引：0
|
作者：
Liu, Lilong [1 ]
Lu, Qian [1 ]
Wang, Yipeng [1 ]
Dai, Weifeng [1 ]
Zhang, Xin [1 ]
Li, Yuesheng [1 ]
Wu, Xiaojing [1 ]
机构：
[1] Fudan Univ, Dept Mat Sci, Shanghai, Peoples R China
来源：
2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009) | 2009年
关键词：
OXIDATION; LEADFRAME; OXIDE; METAL;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The Cu leadframes pre-plated with nickel-coating were implanted with oxygen ion or nitrogen ion by Plasma Immersion Ion Implantation (Pill) technique. The contact angle measurement showed that ion-implantation lead to an obvious change of wettability. The chemical situation of the leadframe surfaces was analyzed by X-ray Photoelectron Spectroscopy (XPS), while the morphology of the leadframes was observed by scanning electron microscope (SEM). A pull-test was employed to examine the influences of ion-implantation on adhesion between the leadframe surface and molding compound.
引用
收藏
页码：865 / 868
页数：4
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