Preparation and thermal conductivity of C/C composites filled with diamond particles

被引：24

作者：

Han, Xiao ^{[1
]}

Zhang, Shouyang ^{[1
]}

Li, Wei ^{[1
]}

Gu, Shengyue ^{[1
]}

Guo, Yao ^{[1
]}

机构：

[1] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Shaanxi, Peoples R China

来源：

基金：

中国国家自然科学基金;

关键词：

C/C-diamond composites; High texture; Microstructure; Thermal conductivity; CARBON-CARBON COMPOSITES; CHEMICAL-VAPOR INFILTRATION; MATRIX COMPOSITES; THERMOPHYSICAL PROPERTIES; MICROSTRUCTURE; ETHANOL; METHANE; DENSIFICATION; TEXTURE;

D O I：

10.1016/j.diamond.2018.07.002

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In order to improve the thermal conductivity of C/C composites, micro-scale high thermal conductive diamond particles were filled into unidirectional carbon fiber reinforced high texture (HT) pyrolytic carbon (PyC) matrix composites to generate C/C-diamond composites by isothermal chemical vapor infiltration (ICVI) method. Microstructure of C/C-diamond composites was characterized by polarized-light microscope, X-ray diffraction, scanning electron microscope and Raman spectroscopy. HT PyC can nucleate surrounding the surface of diamond and grow in laminar structure, and has a higher graphitization degree. The effects of diamond particles with different volume fraction on thermal diffusivity and thermal conductivity of C/C-diamond composites were discussed. The thermal conductivity of C/C-diamond composites with the diamond particle content of 2 vol% was 19.6% higher than that of C/C composites. However, with the further increase of diamond particle content, HT PyC laminar structure became disorganized and the interfacial pores between diamond and PyC increased in turn, resulting in the increase of interfacial thermal resistance. Therefore, the thermal conductivity of C/C-diamond increased at first and then followed downward tendency with the increase of diamond particle content. A model related to the heat conduction of C/C-diamond composites was proposed.

引用

页码：85 / 92

页数：8

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