Ultrafast thin-disk multi-pass amplifier system providing 1.9 kW of average output power and pulse energies in the 10 mJ range at 1 ps of pulse duration for glass-cleaving applications

被引：63

作者：

Dietz, Thomas ^{[1
,2
,3
]}

Jenne, Michael ^{[4
]}

Bauer, Dominik ^{[1
]}

Scharun, Michael ^{[1
]}

Sutter, Dirk ^{[1
]}

Killi, Alexander ^{[1
]}

机构：

[1] TRUMPF Laser GmbH, Aichhalder Str 39, D-78126 Schramberg, Germany

[2] Univ Konstanz, Dept Phys, D-78457 Constance, Germany

[3] Univ Konstanz, Ctr Appl Photon, D-78457 Constance, Germany

[4] Trumpf Laser & Systemtech GmbH, Johann Maus Str 2, D-71254 Ditzingen, Germany

来源：

OPTICS EXPRESS | 2020年 / 28卷 / 08期

基金：

欧盟地平线“2020”;

关键词：

LASER; AMPLIFICATION; OSCILLATOR;

D O I：

10.1364/OE.383926

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

An ultrafast Yb-doped thin-disk multi-pass laser amplifier system with flexible parameters for material processing is reported. We can generate bursts consisting of four pulses at a distance of 20 ns and a total energy of 46.7 mJ at a repetition rate of 25 kHz. In single-pulse operation, 1.5 kW of average output is achieved at 400 kHz when optimizing for a beam quality of M-2 = 1.5. Alignment for maximum output power provides 1.9 kW at the same repetition rate. All results are obtained without chirped-pulse amplification in the multi-pass set-up. The application potential of the system is demonstrated exploring its performance in materials processing of dielectrics. Cleaving of 3.8-mm-thick SCHOTT borofloat glass with a velocity of 1200 mm/s is demonstrated with 300 W of input power. Single-pass modification of 30 mm borosilicate glass is enabled with a Bessel beam at 1 kW of average power delivered by four-pulse bursts of an energy of 30 mJ. (C) 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreement

引用

页码：11415 / 11423

页数：9