The role of oxidant in HF-based solution for noble metal removal from substrate

被引:2
作者
Choi, GM [1 ]
Yokoi, I
Ohmi, T
机构
[1] Tohoku Univ, Grad Sch Engn, Dept Elect Engn, Sendai, Miyagi 980, Japan
[2] Tohoku Univ, New Ind Creat Hatchery Ctr, Sendai, Miyagi 9808579, Japan
来源
ULTRA CLEAN PROCESSING OF SILICON SURFACES 2000 | 2001年 / 76-77卷
关键词
FOM (HF/O-3); FPM (HF/H2O2); metallic impurity; removal efficiency;
D O I
10.4028/www.scientific.net/SSP.76-77.267
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This study was carried on to investigate and understand the role of oxidant in HF-based solution for removing copper contaminants on crystalline silicon surface. Its removal efficiency in solution is strongly dependent on the amount of oxidants as well as on the oxidation-reduction potential and pH value of solution.
引用
收藏
页码:267 / 270
页数:4
相关论文
共 4 条
[1]  
CHOI GM, 1999, ECS FALL M HAW, P272
[2]   The role of metal induced oxidation for copper deposition on silicon surface [J].
Kim, JS ;
Morita, H ;
Joo, JD ;
Ohmi, T .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (09) :3275-3283
[3]  
MORINAGA H, 1996, J IEICE T ELECT, P343
[4]  
OHMI T, 2000, SWPCC S, P1