High-Efficiency D-Band Monolithically Integrated GaN SBD-Based Frequency Doubler With High Power Handling Capability

被引:14
作者
An, Ning [1 ,2 ]
Li, Li [1 ,2 ]
Wang, Weiguang [1 ,2 ]
Xu, Xiaoyu [1 ,2 ]
Zeng, Jianping [1 ,2 ]
机构
[1] China Acad Engn Phys CAEP, Microsyst & Terahertz Res Ctr, Chengdu 610200, Peoples R China
[2] CAEP, Inst Elect Engn, Mianyang 621000, Sichuan, Peoples R China
基金
中国国家自然科学基金;
关键词
Conversion efficiency; frequency doubler; GaN; monolithic integrated circuit; terahertz (THz);
D O I
10.1109/TED.2022.3190463
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A high-efficiency D-band monolithically integrated GaN frequency doubler based on a pair of antiseries four-anode planar GaN Schottky barrier diodes (SBDs) has been successfully fabricated. Unlike the traditional hybrid integrated circuit technology, the monolithic integrated circuit technology has been used in the design and fabrication of GaN SBD-based frequency doubler circuits to achieve good alignment and low conversion losses. At room temperature, the experiments show that the peak conversion efficiency reaches 17.0% at 115.6 GHz under a continuous wave (CW) driving which is a critical requirement for many practical applications. The efficiency of 17.0% is the highest efficiency of GaN SBD-based multipliers at present under CW driving mode. This monolithically integrated doubler also exhibits a broadband high efficiency characteristic of more than 4.7% (-5.58 dB from 17%) across a 10% band from 109 to 121 GHz. In addition, high CW power handling capability of the proposed frequency doubler is verified. The experiments show that the frequency doubler can endure a maximum CW input power of 0.5 W.
引用
收藏
页码:4843 / 4847
页数:5
相关论文
共 22 条
[11]   THz Diode Technology: Status, Prospects, and Applications [J].
Mehdi, Imran ;
Siles, Jose V. ;
Lee, Choonsup ;
Schlecht, Erich .
PROCEEDINGS OF THE IEEE, 2017, 105 (06) :990-1007
[12]   Thermal conductivity, dislocation density and GaN device design [J].
Mion, C. ;
Muth, J. F. ;
Preble, Edward A. ;
Hanser, Drew .
SUPERLATTICES AND MICROSTRUCTURES, 2006, 40 (4-6) :338-342
[13]  
Ning An, 2019, 2019 IEEE 3rd International Conference on Circuits, Systems and Devices (ICCSD), P1, DOI 10.1109/ICCSD.2019.8843218
[14]   Analysis and modelling of GaN Schottky-based circuits at millimeter wavelengths [J].
Pardo, D. ;
Grajal, J. .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2015, 30 (11)
[15]  
Porterfield D, 2005, IRMMW-THz2005: The Joint 30th International Conference on Infrared and Millimeter Waves and 13th International Conference on Terahertz Electronics, Vols 1 and 2, P78
[16]   An electron mobility model for wurtzite GaN [J].
Schwierz, F .
SOLID-STATE ELECTRONICS, 2005, 49 (06) :889-895
[17]   A High-Power 105-120 GHz Broadband On-Chip Power-Combined Frequency Tripler [J].
Sites, Jose V. ;
Lee, Choonsup ;
Lin, Robert ;
Chattopadhyay, Goutam ;
Reck, Theodore ;
Jung-Kubiak, Cecile ;
Mehdi, Imran ;
Cooper, Ken B. .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2015, 25 (03) :157-159
[18]   GaN-Based Frequency Doubler With Pulsed Output Power Over 1 W at 216 GHz [J].
Song, Xubo ;
Liang, Shixiong ;
Lv, Yuanjie ;
Zhang, Zhenpeng ;
Zhang, Lisen ;
Fu, Xingchang ;
Guo, Yanmin ;
Gu, Guodong ;
Wang, Yuangang ;
Fang, Yuan ;
Bu, Aimin ;
Cai, Shujun ;
Feng, Zhihong .
IEEE ELECTRON DEVICE LETTERS, 2021, 42 (12) :1739-1742
[19]   High Power W-band Monolithically Integrated Tripler [J].
Vukusic, Josip ;
Bryllert, Tomas ;
Olsen, Arne Oistein ;
Stake, Jan .
2009 34TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES, VOLS 1 AND 2, 2009, :684-+
[20]   Development of High Power 220 GHz Frequency Triplers Based on Schottky Diodes [J].
Yang, Yilin ;
Zhang, Bo ;
Wang, Yiwei ;
Niu, Zhongqian ;
Ji, Dongfeng ;
Zhao, Xiangyang ;
Fan, Yong .
IEEE ACCESS, 2020, 8 :74401-74412