Effect of solidification conditions on structure and properties of rapidly-solidified Sn-7.5wt%Sb alloy

被引：5
作者：
Gouda, El Said [1 ]
机构：
[1] Natl Res Ctr, Dept Solid State Phys, Met Lab, Giza, Egypt
来源：
MATERIALS AND MANUFACTURING PROCESSES | 2007年 / 22卷 / 7-8期
关键词：
intermetallic compound; rapid solidification; resistivity; Vickers microhardness; young's modulus;
D O I：
10.1080/10426910701446820
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The effect of cooling speed on structure and properties of the rapidly-solidified Sn-7.5wt%Sb has been investigated. The samples in this study were prepared using a single roller melt spinning technique with two speeds: 15.7 and 30.7 m/s, respectively. The results showed formation of the intermetallic compound SnSb. This intermetallic compound changes in the amount which precipitated in the two samples. This behavior tends to affect the properties of these two samples. Also higher cooling speed tends to reduce the crystallite size, which in turn reduces the melting point of the resulting alloy compared to that of the lower cooling speed.
引用
收藏
页码：842 / 845
页数：4
相关论文
共 13 条
  • [1] ANANTHARAMAN TR, 1987, RAPIDLY SOLIDIFIED A
  • [2] [Anonymous], 1993, Rapidly solidified alloys: processes-structures-properties-applications
  • [3] ELBEDIWI AB, 2004, AMSE MODELING, V65, P1
  • [4] New lead-free solder alloy
    Kamal, M
    Meikhail, MS
    El-Bediwi, AB
    Gouda, ES
    [J]. RADIATION EFFECTS AND DEFECTS IN SOLIDS, 2005, 160 (07): : 301 - 312
  • [5] The effect of rapid solidification on the structure, decomposition behavior, electrical and mechanical properties of the Sn-Cd binary alloys
    Kamal, M
    El-Bediwi, AB
    El-Ashram, T
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2004, 15 (04) : 211 - 217
  • [6] Effect of rapid solidification on structure and properties of some lead-free solder alloys
    Kamal, Mustafa
    Gouda, El-Said
    [J]. MATERIALS AND MANUFACTURING PROCESSES, 2006, 21 (08) : 736 - 740
  • [7] Decomposition behavior and properties for tin-antimony alloy with bismuth content
    Kamal, Mustafa
    Gouda, El Said
    [J]. RADIATION EFFECTS AND DEFECTS IN SOLIDS, 2006, 161 (07): : 427 - 431
  • [8] DEFORMATION AND FRACTURE-BEHAVIOR OF SN-5-PERCENT-SB SOLDER
    MAHIDHARA, RK
    SASTRY, SML
    TURLIK, I
    MURTY, KL
    [J]. SCRIPTA METALLURGICA ET MATERIALIA, 1994, 31 (09): : 1145 - 1150
  • [9] NUTTALL K, 1971, J I MET, V99, P266
  • [10] Surface melting on small particles
    Peters, KF
    Chung, YW
    Cohen, JB
    [J]. APPLIED PHYSICS LETTERS, 1997, 71 (16) : 2391 - 2393
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