Coupled effect of crystallographic orientation and indenter geometry on nanoindentation of single crystalline copper

Surface pile-up topography is very significant for property extraction in nanoindentation tests. In the present work, we perform crystal plasticity finite element simulations of Berkovich nanoindentation of single crystalline copper with different crystallographic orientations, which derive quantitatively comparable mechanical properties and surface pile-up topographies with experimental data. Simulation results demonstrate that there is a coupled effect of crystallographic orientation of indented material and indenter geometry on surface pile-up behavior, due to the interaction between intrinsic dislocation slip events and extrinsic discrete stress distribution patterns. Based on the relative spatial orientation between crystallographic orientation of indented material and indenter geometry, a surface pile-up density factor rn, is proposed to qualitatively characterize the propensity of surface pile-up behavior in nanoindentation tests of single crystalline copper.