Reliability test and failure analysis of high-brightness LEDs from Cree under the various injection currents

被引:0
|
作者
Liu, W. [1 ]
Li, N. [1 ]
Lei, P. [1 ]
Zou, B. B. [1 ]
Jin, P. [1 ]
机构
[1] Peking Univ, Shenzhen Grad Sch, Sch Environm & Energy, Shenzhen, Peoples R China
来源
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2013年
关键词
high power LEDs; reliability; failure; electrical stress; LED package technique; TEMPERATURE; DEGRADATION; MECHANISMS; TECHNOLOGY;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the reliability and degradation mechanisms of high-brightness LEDs were studied, which were prepared by Cree and currently available on the market. Results revealed that operating currents had an important effect on the service performance of treated LEDs. Only at 350mA the tested LEDs had a good performance; at 750mA and 1000mA, they had the significant degradation; at 2000mA, they had the serious failure of death light within 24 hours. Encapsulant carbonization, delamination and interfacial defects were found to contribute to the degradation of high power LEDs. This study would provide some guidance for the end users as well as some basic data for the current package technique.
引用
收藏
页码:1184 / 1188
页数:5
相关论文
共 8 条
  • [1] Fabrication process simulation and reliability improvement of high-brightness LEDs
    Chou, Tsung-Lin
    Huang, Chien-Fu
    Han, Cheng-Nan
    Yang, Shin-Yueh
    Chiang, Kuo-Ning
    MICROELECTRONICS RELIABILITY, 2009, 49 (9-11) : 1244 - 1249
  • [2] Transient voltage suppressor diode designed for the protection of high-brightness GaN-based LEDs from various electrostatic discharge shocks
    Bouangeune, Daoheung
    Lee, Ye-Ji
    Cho, Jaehee
    Shim, Kyu-Hwan
    Choi, Chel-Jong
    Choi, Sang-Sik
    Cho, Deok-Ho
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2014, 65 (07) : 1106 - 1112
  • [3] Reliability Estimation and Failure Analysis of LEDs with Various Currents and Correlated Color Temperatures for Identical Power Ratings: A Comparative Study
    Lokesh, J.
    Kini, S. G.
    Padmasali, A. N.
    Mahesha, M. G.
    ACS OMEGA, 2025, 10 (08): : 8756 - 8766
  • [4] Failure analysis on reflector blackening between lead frame electrodes in LEDs under WHTOL test
    Zhang, Lei
    Zhu, Yejun
    Chen, Haibin
    Leung, Karina
    Wu, Yeqing
    Wu, Jingshen
    MICROELECTRONICS RELIABILITY, 2015, 55 (05) : 799 - 806
  • [5] Reliability and failure analysis of CSP under bending cycling test
    Huang, TC
    Lai, DP
    Ho, SH
    Lee, J
    Zheng, PJ
    Hwang, JG
    Wu, JD
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 9 - 14
  • [6] Failure-mechanism analysis for vertical high-power LEDs under external pressure
    Chen, Guanggao
    Liu, Xiaokang
    Li, Zongtao
    Tang, Yong
    Lu, Longsheng
    Yu, Binhai
    Chen, Qiu
    MICROELECTRONICS RELIABILITY, 2015, 55 (12) : 2671 - 2677
  • [7] The Case of Failure Analysis of the PCBA Wire Corrosion under High Reliability Requirements
    Zheng, Jie
    Yang, Ying
    Shen, Jianghua
    Ma, Lili
    He, Shengzong
    2019 IEEE 26TH INTERNATIONAL SYMPOSIUM ON PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2019,
  • [8] Failure analysis and reliability reinforcement on gold wire in high-power COB-LED under current and thermal shock combined loading
    Yang, Haiying
    Yang, Bing
    Li, Junchao
    Yang, Ping
    APPLIED THERMAL ENGINEERING, 2019, 150 : 1046 - 1053