Material science and device physics in SiC technology for high-voltage power devices

被引:785
|
作者
Kimoto, Tsunenobu [1 ]
机构
[1] Kyoto Univ, Dept Elect Sci & Engn, Kyoto 6158510, Japan
关键词
CHEMICAL-VAPOR-DEPOSITION; BASAL-PLANE DISLOCATION; GROWN STACKING-FAULTS; IMPACT IONIZATION COEFFICIENTS; SCHOTTKY-BARRIER DIODES; LEVEL TRANSIENT SPECTROSCOPY; CONTROLLED EPITAXIAL-GROWTH; INVERSION CHANNEL MOBILITY; FIELD-EFFECT TRANSISTORS; CORE SCREW DISLOCATIONS;
D O I
10.7567/JJAP.54.040103
中图分类号
O59 [应用物理学];
学科分类号
摘要
Power semiconductor devices are key components in power conversion systems. Silicon carbide (SiC) has received increasing attention as a wide-bandgap semiconductor suitable for high-voltage and low-loss power devices. Through recent progress in the crystal growth and process technology of SiC, the production of medium-voltage (600-1700 V) SiC Schottky barrier diodes (SBDs) and power metal-oxide-semiconductor field-effect transistors (MOSFETs) has started. However, basic understanding of the material properties, defect electronics, and the reliability of SiC devices is still poor. In this review paper, the features and present status of SiC power devices are briefly described. Then, several important aspects of the material science and device physics of SiC, such as impurity doping, extended and point defects, and the impact of such defects on device performance and reliability, are reviewed. Fundamental issues regarding SiC SBDs and power MOSFETs are also discussed. (c) 2015 The Japan Society of Applied Physics
引用
收藏
页数:27
相关论文
共 50 条
  • [1] Defect engineering in SiC technology for high-voltage power devices
    Kimoto, Tsunenobu
    Watanabe, Heiji
    APPLIED PHYSICS EXPRESS, 2020, 13 (12)
  • [2] High-voltage SiC and GaN power devices
    Chow, TP
    MICROELECTRONIC ENGINEERING, 2006, 83 (01) : 112 - 122
  • [3] High-voltage SiC and GaN power devices
    Chow, TP
    PROCEEDING OF THE 2004 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 2004, : 198 - 200
  • [4] Recent advances in high-voltage SiC power devices
    Chow, TP
    Ramungul, N
    Ghezzo, M
    1998 HIGH-TEMPERATURE ELECTRONIC MATERIALS, DEVICES AND SENSORS CONFERENCE, 1998, : 55 - 67
  • [5] SiC and GaN high-voltage power switching devices
    Chow, T.P.
    Materials Science Forum, 2000, 338
  • [6] SiC and GaN high-voltage power switching devices
    Chow, TP
    SILICON CARBIDE AND RELATED MATERIALS - 1999 PTS, 1 & 2, 2000, 338-3 : 1155 - 1160
  • [7] Promise and Challenges of High-Voltage SiC Bipolar Power Devices
    Kimoto, Tsunenobu
    Yamada, Kyosuke
    Niwa, Hiroki
    Suda, Jun
    ENERGIES, 2016, 9 (11)
  • [8] Ion Implantation Technology in SiC for High-Voltage/High-Temperature Devices
    Kimoto, T.
    Kawahara, K.
    Kaji, N.
    Fujihara, H.
    Suda, J.
    2016 16TH INTERNATIONAL WORKSHOP ON JUNCTION TECHNOLOGY (IWJT), 2016, : 54 - 58
  • [9] MV Power Conversion Systems Enabled by High-Voltage SiC Devices
    Bhattacharya, Subhashish
    IEEE POWER ELECTRONICS MAGAZINE, 2019, 6 (04): : 18 - 21
  • [10] Review High-voltage SiC power devices for improved energy efficiency
    Kimoto, Tsunenobu
    PROCEEDINGS OF THE JAPAN ACADEMY SERIES B-PHYSICAL AND BIOLOGICAL SCIENCES, 2022, 98 (04): : 161 - 189