Photoluminescence study of ion-implanted silicon

被引:0
作者
Terashima, K [1 ]
Ikarashi, T
Watanabe, M
Kitano, T
机构
[1] NEC Corp Ltd, Silicon Syst Res Labs, Tokyo, Japan
[2] NEC Corp Ltd, Fundamental Res Labs, Tokyo, Japan
[3] ULSI, Device Dev Lab, Kawasaki, Kanagawa, Japan
来源
NEC RESEARCH & DEVELOPMENT | 1998年 / 39卷 / 03期
关键词
photoluminescence (PL); silicon; ion implantation; transition-metal; point defect;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Defects in silicon induced by ion implantation and thermal annealing have been investigated by Photoluminescence (PL) measurement. B or P was implanted at 300 keV or 700 keV, respectively, and the fluence was 2.0 x 10(13) cm(-2). Sharp I-lines and broad emission bands were observed in the PL spectra. The annealing behavior of the PL spectra was different between Furnace Annealing (FA) and Rapid Thermal Annealing (RTA). In the case of FA below 600 degrees C, we have observed luminescence lines at 0.992 eV and at 1.097 eV. The 1.097 eV line did not depend on the annealing atmosphere or the transition-metal contamination. The 0.992 eV line appeared only after annealing in vacuum and was strongly affected by the Cu contamination. The Fe contamination also affected the appearance of the 0.992 eV line while the Ni contamination did not. We believe that these lines are due to the different types of point defect clusters and that the transition-metal, especially Cu, enhances the formation of the 0.992 eV center. The annealing behavior of the PL spectra suggests a strong correlation between the 0.992 eV center and the I1 center.
引用
收藏
页码:289 / 298
页数:10
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