Large scale W-band focal plane array developments for passive millimeter wave imaging

被引：4

作者：

Kuroda, RT ^{[1
]}

Dow, GS ^{[1
]}

Moriarty, DT ^{[1
]}

Johnson, RE ^{[1
]}

Quil, AY ^{[1
]}

Tran, SD ^{[1
]}

Pajo, V ^{[1
]}

Fornaca, S ^{[1
]}

Yujiri, L ^{[1
]}

机构：

[1] TRW Co Inc, Space & Elect Grp, Redondo Beach, CA 90278 USA

来源：

PASSIVE MILLIMETER-WAVE IMAGING TECHNOLOGY II | 1998年 / 3378卷

关键词：

MMIC; focal plane array; W-band array; HEMT; radiometry;

D O I：

10.1117/12.319405

中图分类号：

V [航空、航天];

学科分类号：

08 ; 0825 ;

摘要：

A state-of-the-art W-Band passive millimeter wave focal plane array (FPA) consisting of 1040 highly integrated direct detection pixel has been designed, developed, assembled and tested. The FPA has been integrated into a passive millimeter wave video camera and has generated real time images. Each pixels is a highly integrated MMIC chip receivers. The MMIC chips is a wide band, high gain, low noise, 0.1 mu m InGaAs HEMT amplifier with an integrated switch and Schottky barrier diode detector. The FPA uses a brick architecture. Each brick or module consists of 4 MMIC chips or pixels and lays side-by-side on the card. Many cards are stacked to create the array of pixels. In the next generation FPA, the 1x4 modules and cards have been dramatically simplified with 50% less assembly time. In addition, the module and card still require no tuning and minimal test time. Thus a significant cost reduction in the FPA is expected over the first generation FPA without sacrificing performance. To further reduce cost and improve performance, new MMIC chips are being designed.

引用

页码：57 / 62

页数：6