A NOVEL LIQUID-PACKAGING TECHNOLOGY FOR HIGHLY RELIABLE UV-LED ENCAPSULATION

被引：7

作者：

Zhang, Wen-Hua ^{[1
]}

Lin, Wei-Keng ^{[1
]}

Yeh, Chih-Ting ^{[2
]}

Chiang, Song-Bor ^{[3
]}

Jao, Chih-Sheng ^{[3
]}

机构：

[1] Natl Tsing Hua Univ, Dept Engn & Syst Sci, Hsinchu, Taiwan

[2] Natl Chiao Tung Univ, Dept Mech Engn, Hsinchu, Taiwan

[3] Ind Technol Res Inst, Green Energy & Environm Res Labs, Hsinchu, Taiwan

来源：

HEAT TRANSFER RESEARCH | 2019年 / 50卷 / 04期

关键词：

liquid-packaging; UV LED; silicon oil; thermal resistance; heat dissipation; LIGHT-EMITTING-DIODES; WATER;

D O I：

10.1615/HeatTransRes.2018025129

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper proposes a liquid-packaging technology for UV LED. Unlike the traditional packaging methods that involve thermosetting silicon or quartz glass, the proposed method primarily uses silicon oil to directly contact the chip, which prevents erosion due to moisture or oxygen. In this study, UV LEDs with high heat dissipation technology were selected, and the experimental results of optical and thermal management were compared between the general packaging and liquid-packaging structures, respectively. The results of the optical experiments showed that the proposed method increases the extraction efficiency by 9.5%. The results of the heat dissipation experiments showed that the liquid-packaging technology can reduce the thermal resistance of the UV-LED package by 31%.

引用

页码：349 / 360

页数：12

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