Design of a test structure to evaluate electro-thermomigration in power ICs

被引：2

作者：

DeMunari, I ^{[1
]}

Speroni, F ^{[1
]}

Reverberi, M ^{[1
]}

Neva, C ^{[1
]}

Lonzi, L ^{[1
]}

Fantini, F ^{[1
]}

机构：

[1] SGS THOMSON MICROELECT,I-20010 CORNAREDO,MILANO,ITALY

来源：

MICROELECTRONICS AND RELIABILITY | 1996年 / 36卷 / 11-12期

关键词：

D O I：

10.1016/0026-2714(96)00219-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The design of a novel test structure to study the influence of electromigration and thermomigration in the large dimension metal lines used in power integrated circuits is reported. Incorporated into the test structure are a heating element and a number of temperature monitors, to enhance the thermal gradient and to measure it, respectively. Thermal simulations have been performed and compared with the electrical characterization carried out on a set of test structures. The agreement between simulation end electrical measurements has been proved confirming the validity of the test structure as a vehicle for a deeper understanding of the reliability of the line under the influence of thermal gradients. Copyright (C) 1996 Elsevier Science Ltd

引用

页码：1875 / 1878

页数：4