Influence of cooling speed on the solidification of a hyper-eutectic Cu-Sn alloy

被引：7

作者：

Mardare, Cezarina Cela ^{[1
]}

Hassel, Achim Walter ^{[1
]}

机构：

[1] Johannes Kepler Univ Linz, Inst Chem Technol Inorgan Mat, A-4040 Linz, Austria

来源：

PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE | 2012年 / 209卷 / 05期

关键词：

Cu-Sn; directional solidification; hyper-eutectic composition; intermetallic phases; solders; LEAD-FREE SOLDER; INTERMETALLIC COMPOUNDS; INTERFACIAL REACTIONS; MICROSTRUCTURE; CU6SN5; NI; COPPER; TIN;

D O I：

10.1002/pssa.201100617

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Cu-Sn alloys with a hyper-eutectic composition (97.53 at% Sn, 2.42 at% Cu and 0.05 at% impurities) were melted in a Bridgman-type furnace and cooled at different velocities ranging from free fall to 13 mu m/s. The formation of the intermetallic phase along the alloys, as well as the size, distribution and microstructure were observed as a function of cooling speed, showing different particle morphologies and growth. The intermetallic phase formed was Cu6Sn5 as confirmed by chemical analysis and X-ray measurements. Electron backscattered diffraction (EBSD) measurements indicate that the eta'-monoclinic phase of the Cu6Sn5 intermetallic was formed on all samples, together with the beta-Sn. [GRAPHICS] (c) 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

引用

页码：825 / 831

页数：7

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