The effect of photodiode shape on charge transfer in CMOS image sensors

被引:36
作者
Shin, Bhumjae [1 ]
Park, Sangsik [1 ]
Shin, Hyuntaek
机构
[1] Sejong Univ, Dept Elect Engn, Seoul 143747, South Korea
关键词
Image sensor; CMOS; Photodiode; Charge transfer; Depletion; NOISE;
D O I
10.1016/j.sse.2010.06.006
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The output signal of a CMOS image sensor is derived from the electrons generated by light incident on the pinned photodiode in each pixel. The output voltage depends on the transfer of the signal electrons from the pinned photodiode to the readout node. In large photodiodes it becomes difficult to fully extract the generated electrons because of the reduction in lateral electric field that pushes the electrons to the transfer transistor. To enhance the transfer, a triangular shaped photodiode was proposed which increases the lateral electric field applied to the photo generated electrons. Compared with a conventional rectangular shaped pixel, the electrons are extracted more easily in a triangular shape since the narrow tail end forms an increased potential gradient. A VGA type image sensor chip showed that the triangular photodiode had 50% higher output voltage than a conventional rectangular photodiode. It was verified that the output voltage is enhanced more by the electric force than the light receiving area. The noise due to the residual electrons was not seen in the image acquired from image sensor having triangular photodiode. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1416 / 1420
页数:5
相关论文
共 14 条
[1]  
Abe H, 2004, IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST, P989
[2]   Dimensional effects in CMOS photodiodes [J].
Brouk, I ;
Nemirovsky, Y .
SOLID-STATE ELECTRONICS, 2002, 46 (01) :19-28
[3]  
BURKEY BC, 1984, P IEDM, P28
[4]   How small should pixel size be? [J].
Chen, T ;
Catrysse, P ;
El Gamal, A ;
Wandell, B .
SENSORS AND CAMERA SYSTEMS FOR SCIENTIFIC, INDUSTRIAL AND DIGITAL PHOTOGRAPHY APPLICATIONS, 2000, 3965 :451-459
[5]  
FOSSUM ER, 2003, IEEE WORKSH CCD ADV
[6]   A 0.6 μm CMOS pinned photodiode color imager technology [J].
Guidash, RM ;
Lee, TH ;
Lee, PPK ;
Sackett, DH ;
Drowley, CI ;
Swenson, MS ;
Arbaugh, L ;
Hollstein, R ;
Shapiro, F ;
Domer, S .
INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, :927-929
[7]   Low-leakage-current and low-operating-voltage buried photodiode for a CMOS imager [J].
Inoue, I ;
Tanaka, N ;
Yamashita, H ;
Yamaguchi, T ;
Ishiwata, H ;
Ihara, H .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (01) :43-47
[8]   Random noise generation mechanism for a CCD imager with an incomplete transfer-type storage diode [J].
Nakamura, N ;
Shioyama, Y ;
Ohsawa, S ;
Sugiki, T ;
Matsunaga, Y .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1996, 43 (11) :1883-1889
[9]   256X256 CMOS active pixel sensor camera-on-a-chip [J].
Nixon, RH ;
Kemeny, SE ;
Pain, B ;
Staller, CO ;
Fossum, ER .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1996, 31 (12) :2046-2050
[10]   A 1-MEGAPIXEL, PROGRESSIVE-SCAN IMAGE SENSOR WITH ANTIBLOOMING CONTROL AND LAG-FREE OPERATION [J].
STEVENS, EG ;
BURKEY, BC ;
NICHOLS, DN ;
YEE, YS ;
LOSEE, DL ;
LEE, TH ;
TREDWELL, TJ ;
KHOSLA, RP .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (05) :981-988