An Algorithm for Power Supply Noise Reduction Inserting Decoupling Capacitor in 2D and 3D IC Power Delivery Networks

被引:0
作者
Mondal, Khokan [1 ]
Samanta, Tuhina [1 ]
机构
[1] Indian Inst Engn Sci & Technol, Dept Informat Technol, Sibpur 711103, W Bengal, India
关键词
Decoupling capacitor; 3D IC; IR drop; Ldi; dt noise; power delivery network; TSV; VLSI design;
D O I
10.1080/03772063.2022.2135616
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
VLSI technology enters into the ultra-nanometer era and supply voltages continue to reduce. But, chip density is increased. It creates power integrity problems even worse. Allocating decoupling capacitances (decaps) is a known approach to alleviating supply noise problems. The availability of white space for allocating decoupling capacitors is a challenging task due to the increase in circuit density and reduction in size. In this work, an algorithm is introduced to mitigate power supply noise. The proposed algorithm provides an effective assignment of decoupling capacitors with fewer capacitors that satisfy a predefined target impedance. Next, we also study IR drops for 2D and 3D ICs. TSV optimization is also done. The results are compared with recent works and the outcomes are quite inspiring.
引用
收藏
页码:638 / 648
页数:11
相关论文
共 23 条
[1]  
Amelifard B, 2007, ISLPED'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN, P328, DOI 10.1145/1283780.1283850
[2]  
[Anonymous], 2015, INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS 2.0
[3]  
Beyne E, 2008, INT EL DEVICES MEET, P495
[4]   Interconnect and circuit modeling techniques for full-chip power supply noise analysis [J].
Chen, HH ;
Neely, JS .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1998, 21 (03) :209-215
[5]   Decoupling Capacitor Placement in Power Delivery Networks Using MFEM [J].
Choi, Jae Young ;
Swaminathan, Madhavan .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (10) :1651-1661
[6]  
Cong J., 2009, 2009 INT C COMMUNICA
[7]   High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs [J].
Hashiguchi, Hideto ;
Fukushima, Takafumi ;
Murugesan, Mariappan ;
Kino, Hisashi ;
Tanaka, Tetsu ;
Koyanagi, Mitsumasa .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (01) :181-188
[8]  
Heilprin A., 2019, GOOGLE PATENTS
[9]   Control techniques to eliminate voltage emergencies in high performance processors [J].
Joseph, R ;
Brooks, D ;
Martonosi, M .
NINTH INTERNATIONAL SYMPOSIUM ON HIGH-PERFORMANCE COMPUTER ARCHITECTURE, PROCEEDINGS, 2003, :79-90
[10]   Fast Algorithm for Minimizing the Number of decap in Power Distribution Networks [J].
Koo, Kyoungchoul ;
Luevano, Gerardo Romo ;
Wang, Tao ;
Ozbayat, Selman ;
Michalka, Tim ;
Drewniak, James L. .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2018, 60 (03) :725-732