Modelling for fabrication of microelectrodes by localized electrochemical deposition for micro-electrodischarge machining

被引:4
作者
Habib, M. A. [1 ]
Shaleh, T. [1 ]
Rahman, M. [1 ]
机构
[1] Natl Univ Singapore, Dept Mech Engn, Singapore 119260, Singapore
关键词
localized electrochemical deposition (LECD); microstructure; pulse amplitude; pulse frequency; pulse duty ratio; EDM electrode; ASPECT-RATIO MICROSTRUCTURES; CHEMICAL-VAPOR-DEPOSITION; EDM ELECTRODES; MICROFABRICATION; COPPER; FILMS;
D O I
10.1243/09544054JEM1928
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents the theoretical modelling and experimental investigation on the effect of different localized electrochemical deposition (LECD) parameters for fabricating a variety of microstructures. In order to estimate the rate of the deposition and the condition of the deposited structure, a set of mathematical relations is developed with the help of Faraday's laws of electrolysis and the Butler-Volmer equation. Mathematical simulation results are validated by experimental results. In this experimental process copper was deposited on the cathode surface. The variation in structure of the deposited electrode is achieved by changing the shape of a non-conductive mask. This mask is fabricated by an on-machine micromilling process and it is kept in contact with the cathode surface. The whole system is immersed in an acidified copper sulphate plating solution. This study gives a clear indication of the optimized operating range for the LECD process in order to fabricate high aspect ratio microstructures. Futhermore, the performance of the LECD electrode is evaluated by the fabrication of microholes on high-melting-point material such as a stainless steel workpiece.
引用
收藏
页码:1741 / 1755
页数:15
相关论文
共 30 条
[1]  
[Anonymous], PLASMA CHEM PLASMA P
[2]  
BRENDAN BA, 2006, BIOMATERIALS, V27, P866
[3]   Investigation of micro-cutting operations [J].
Chae, J ;
Park, SS ;
Freiheit, T .
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2006, 46 (3-4) :313-332
[4]   Localized electrochemical deposition of copper microstructures [J].
El-Giar, EM ;
Said, RA ;
Bridges, GE ;
Thomson, DJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (02) :586-591
[5]  
GELCHINSKI MH, 1985, Patent No. 4497692
[6]   Fabrication of complex shape electrodes by localized electrochemical deposition [J].
Habib, M. A. ;
Gan, S. W. ;
Rahman, M. .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2009, 209 (09) :4453-4458
[7]  
Habib MA, 2008, INT J PRECIS ENG MAN, V9, P75
[8]  
Hess C, 1997, ELECTROCHIM ACTA, V42, P3065
[9]   Electrostatic spraying: A novel technique for preparation of polymer coatings on electrodes [J].
Hoyer, B ;
Sorensen, G ;
Jensen, N ;
Nielsen, DB ;
Larsen, B .
ANALYTICAL CHEMISTRY, 1996, 68 (21) :3840-3844
[10]   Laser-assisted chemical vapor deposition of titanium nitride films [J].
Ishihara, S ;
Hanabusa, M .
JOURNAL OF APPLIED PHYSICS, 1998, 84 (01) :596-599