Stress relaxation in ultrafine-grained copper at low homologous temperatures

被引：1
作者：
Isaev, N. V. [1 ]
Hryhorova, T. V. [1 ]
Davydenko, O. A. [2 ]
Polishchuk, S. S. [3 ]
机构：
[1] Natl Acad Sci Ukraine, BI Verkin Inst Low Temp Phys & Engn, 47 Nauki Ave, UA-61103 Kharkov, Ukraine
[2] Natl Acad Sci Ukraine, OO Galkin Donetsk Inst Phys & Engn, 46 Nauki Ave, UA-03028 Kiev, Ukraine
[3] Natl Acad Sci Ukraine, GV Kurdyumov Inst Met Phys, 36 Acad Vernadsky Blvd, UA-03680 Kiev, Ukraine
来源：
LOW TEMPERATURE PHYSICS | 2018年 / 44卷 / 11期
关键词：
STRAIN-RATE SENSITIVITY; PLASTIC-DEFORMATION; FLOW-STRESS; DEPENDENCE; DYNAMICS; KINETICS; RANGE; MODEL;
D O I：
10.1063/1.5062159
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
The temperature and rate sensitivity of the flow stress in ultrafine-grained (UFG) copper prepared by equal-channel angular hydroextrusion was studied. Tensile tests and stress relaxation tests were carried out in the temperature range of 77 to 295 K. It was established that, with increasing temperature, the flow stress decreases monotonously, and the activation volume reaches a maximum of similar to 190b(3) at a temperature of similar to(200 +/- 20) K. The results of the experiment are discussed in terms of two thermally activated plastic deformation mechanisms, namely the intersection of "forest" dislocations and dynamic recovery, which are capable of significantly distorting stress relaxation kinetics in UFG copper. Published by AIP Publishing.
引用
收藏
页码：1204 / 1210
页数：7
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