Analysis of the side gap resulting from micro electrochemical machining with a tungsten wire and ultrashort voltage pulses

被引:109
作者
Shin, Hong Shik [1 ]
Kim, Bo Hyun [2 ]
Chu, Chong Nam [1 ]
机构
[1] Seoul Natl Univ, Sch Mech & Aerosp Engn, Seoul 151742, South Korea
[2] Andong Natl Univ, Sch Mech Engn, Andong 760749, Gyeongbuk, South Korea
关键词
D O I
10.1088/0960-1317/18/7/075009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Micro wire electrochemical machining (ECM) using a empty set 10 mu m tungsten wire as the tool electrode is presented. Since electrochemical machining does not wear out the tool, it can be easily applied to the fabrication of micro grooves by moving the tool electrode along a programmed toolpath. To minimize the side gap, ultrashort voltage pulses were applied between the tool electrode and the workpiece. Changes in the side gap according to the applied pulse voltage, pulse on-time and pulse period were investigated, and the optimal pulse condition for stable machining was obtained. By using this method, micro features such as micro grooves and gears were fabricated into stainless steel plates.
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页数:6
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