Fiber Array Unit with Reduced Clad Fibers for High-Density Fiber-Chip Coupling

被引：0
|
作者：
Bickham, Scott R. [1 ]
Kuang, Wen-Lung [2 ]
Feng, Ximao [2 ]
机构：
[1] Corning Opt Commun, Corning, NY 14830 USA
[2] Corning Opt Connect Solut, New Taipei 236, Taiwan
来源：
2019 IEEE CPMT SYMPOSIUM JAPAN (ICSJ) | 2019年
关键词：
fiber array; reduced-clad fiber; fiber-chip coupling; optical backplane component;
D O I：
10.1109/icsj47124.2019.8998750
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We discuss the integration of G.657-compatible reduced-clad bend-insensitive (RCBI) fibers into two-dimensional fiber array units (FAUs) and into FAUs incorporating 90-degree bends to enable high-density and small form-factor fiber-chip connectivity solutions.
引用
收藏
页码：59 / 62
页数：4
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