Self-packaged high-resolution liquid metal nano-patterns

被引:34
作者
An, Licong [1 ,3 ]
Jiang, Haoqing [2 ,4 ]
Branco, Danilo de Camargo [5 ]
Liu, Xingtao [2 ,3 ]
Xu, Jin [2 ,3 ]
Cheng, Gary J. [1 ,2 ,3 ]
机构
[1] Purdue Univ, Sch Mat Engn, W Lafayette, IN 47907 USA
[2] Purdue Univ, Sch Ind Engn, W Lafayette, IN 47907 USA
[3] Purdue Univ, Brick Nanotechnol Ctr, W Lafayette, IN 47907 USA
[4] Wuhan Univ, Inst Technol Sci, Wuhan, Peoples R China
[5] Purdue Univ, Sch Aeronaut & Astronaut, W Lafayette, IN 47907 USA
关键词
GALLIUM-INDIUM EGAIN; ELECTRONICS; MORPHOLOGY;
D O I
10.1016/j.matt.2022.01.004
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
High-resolution self-packaged conductive patterns are important in integrated electronics used in harsh environments. One of the most promising candidates is gallium-based liquid due to its unique properties. Here, we introduce an advanced liquid metal nanopatterning technique based on pulsed laser lithography (PLL) to create self-packaged, high-resolution liquid metal patterns. The method described here, for the first time, can directly generate liquid metal nano-patterns with similar to 500-nm line width without being limited by laser beam size. Line-scanning pulsed-laser-induced shock and thermal effects could generate compression on the liquid metal to extrude similar to 200-nm particles to an similar to 30-nm layer covered by an similar to 20-nm oxide shell with boosted mechanical properties. When subjected to external damage, the electrical functionality of the nano-patterns is well maintained due to the protective self-packaged shell and its 3D structure. The electrically self-packaged material with high resolution is a promising candidate to serve in demanding applications with high integration densities.
引用
收藏
页码:1016 / 1030
页数:16
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