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Modulated interlayer charge transfer dynamics in a monolayer TMD/metal junction
被引:38
|作者:
Zhang, Linglong
[1
,2
]
Yan, Han
[2
]
Sun, Xueqian
[2
]
Dong, Miheng
[2
]
Yildirim, Tanju
[2
]
Wang, Bowen
[2
]
Wen, Bo
[2
]
Neupane, Guru Prakash
[2
]
Sharma, Ankur
[2
]
Zhu, Yi
[2
]
Zhang, Jian
[2
]
Liang, Kun
[2
]
Liu, Boqing
[2
]
Nguyen, Hieu T.
[2
]
Macdonald, Daniel
[2
]
Lu, Yuerui
[2
]
机构:
[1] Nanjing Univ, Sch Elect Sci & Engn, Collaborat Innovat Ctr Adv Microstruct, Natl Lab Solid State Microstruct, Nanjing 210093, Jiangsu, Peoples R China
[2] Australian Natl Univ, Res Sch Engn, Coll Engn & Comp Sci, Canberra, ACT 2601, Australia
来源:
基金:
澳大利亚研究理事会;
关键词:
PHOTOLUMINESCENCE;
CONTACTS;
MOS2;
HETEROSTRUCTURES;
EMISSION;
EXCITON;
WS2;
D O I:
10.1039/c8nr08728h
中图分类号:
O6 [化学];
学科分类号:
0703 ;
摘要:
The performance of optoelectronic devices based on monolayer transition-metal dichalcogenide (mTMD) semiconductors is significantly affected by the contact at the mTMD-metal interface, which is dependent on interlayer interactions and coupling. Here, we report a systematic optical method to investigate the interlayer charge transfer and coupling in a mTMD-metal heterojunction. Giant photoluminescence (PL) quenching was observed in a monolayer MoS2/Pd (1L MoS2/Pd) junction which is mainly due to the efficient interlayer charge transfer between Pd and MoS2. 1L MoS2/Pd also exhibits an increase in the PL quenching factor (eta) as the temperature decreases, due to a reduction of the interlayer spacing. Annealing experiments were also performed which supported interlayer charge transfer as the main mechanism for the increase of eta. Moreover, a monolayer MoS2/Au (1L MoS2/Au) junction was fabricated for engineering the interlayer charge transfer. Interestingly, a narrowing effect of the full width at half maximum (FWHM) was encountered as the junctions changed from 1L MoS2/SiO2 -> 1L MoS2/Au -> 1L MoS2/Pd, possibly originating from a change of the doping level induced weakening of exciton-carrier scattering. Our results deepen the understanding of metal-semiconductor junctions for further exploring fundamental phenomena and enabling high-performance devices using mTMD-metal junctions.
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页码:418 / 425
页数:8
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