High-temperature shear strength of lead-free Sn-Sb-Ag/Al2O3 composite solder

被引：62
作者：
Geranmayeh, A. R. [2 ]
Mahmudi, R. [1 ]
Kangooie, M. [1 ]
机构：
[1] Univ Tehran, Sch Met & Mat Engn, Tehran, Iran
[2] Islamic Azad Univ, Dept Mech Engn, S Tehran Branch, Tehran, Iran
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2011年 / 528卷 / 12期
关键词：
Lead-free solder; Composite; Mechanical properties; Shear punch testing; CREEP-PROPERTIES; MICROSTRUCTURE; STABILITY; HARDNESS; JOINTS; SB;
D O I：
10.1016/j.msea.2011.02.034
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The lead-free Sn-1.7Sb-1.5Ag solder alloy and the same material reinforced with 5 vol.% of 0.3-mu m Al2O3 particles were synthesized using the powder-metallurgy route o blending, compaction, sintering, and extrusion. The mechanical properties of both monolithic and composite solders were studied by shear punch testing (SPT) at temperatures in the range of 25-130 degrees C. Depending on the test temperature, the shear yield stress (SYS) increased by 4.8-8.8 MPa, and ultimate shear strength (USS) increased by 6.2-8.8 MPa in the composite material. The strength improvement was mostly due to the CTE mismatch between the matrix and the particles, and to a lesser extent to the Orowan strengthening mechanism of the submicro-sized Al2O3 particles in the composite solder. The contribution of each of these mechanisms was used in a modified shear lag model to predict the total composite-strengthening achieved. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码：3967 / 3972
页数：6
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