We evaluated the change in the chemical structure between dielectrics (AlOx and HfOx) grown by atomic layer deposition (ALD) and oxidized black phosphorus (BP), as a function of air exposure time. Chemical and structural analyses of the oxidized phosphorus species (PxOy) were performed using atomic force microscopy, X-ray photoelectron spectroscopy, scanning electron microscopy, transmission electron microscopy, first-principles density functional theory calculations, and the electrical characteristics of field-effect transistors (FETs). Based on the combined experiments and theoretical investigations, we clearly show that oxidized phosphorus species (PxOy, until exposed for 24 h) are significantly decreased (self-reduction) during the ALD of AlOx. In particular, the field effect characteristics of a FET device based on Al2O3/AlOx/oxidized BP improved significantly with enhanced electrical properties, a mobility of approximate to 253 cm(2) V-1 s(-1) and an on-off ratio of approximate to 10(5), compared to those of HfO2/HfOx/oxidized BP with a mobility of approximate to 97 cm(2) V-1 s(-1) and an on-off ratio of approximate to 10(3)-10(4). These distinct differences result from a significantly decreased interface trap density (D-it approximate to 10(11) cm(-2) eV(-1)) and subthreshold gate swing (SS approximate to 270 mV dec(-1)) in the BP device caused by the formation of stable energy states at the AlOx/oxidized BP interface, even with BP oxidized by air exposure.