FPA technology advancements at Rockwell Scientific

被引：4

作者：

Chuh, T ^{[1
]}

机构：

[1] Rockwell Sci Co, Camarillo, CA 93012 USA

来源：

Infrared Technology and Applications XXXI, Pts 1 and 2 | 2005年 / 5783卷

关键词：

focal plane array; infrared; visible; hybrid; readout; multiplexer; CMOS; mercury cadmium telluride; HgCdTe; ADC; MBE; mosaic;

D O I：

10.1117/12.604169

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

Progress of selected FPA (Focal Plane Array) technology development at Rockwell Scientific Company is reviewed: very large format monolithic visible CMOS, hybrid silicon pin visible CMOS, ultra high frame rate (360ns interframe time) burst mode camera, substrate removed HgCdTe infrared detectors for continuous visible through infrared spectral sensitivity, astronomical focal plane arrays, mosaic (16 megapixel) infrared FPAs, JWST, and the SIDECAR ASIC readout interface chip.

引用

页码：907 / 922

页数：16