Electrochemistry of copper in aqueous oxalic acid solutions

被引：20
|
作者：
Aksu, S [1 ]
机构：
[1] Suleyman Demirel Univ, Fac Engn & Architecture, Min Engn Dept, Minerals & Mat Proc Grp, TR-32260 Isparta, Turkey
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2005年 / 152卷 / 12期
关键词：
D O I：
10.1149/1.2121737
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Oxalic acid is a complexing agent used in both chemical mechanical planarization (CMP) of copper and post-CMP cleaning. Aqueous solubility diagrams and potential-pH diagrams at different total dissolved copper and oxalic acid activities were derived to examine the electrochemistry of copper in aqueous oxalic acid solutions. The predictions of the diagrams are discussed in terms of the experimental data available in the electrochemistry and Cu CMP literature. Good correlations were found. (c) 2005 The Electrochemical Society. All rights reserved.
引用
收藏
页码：G938 / G943
页数：6
相关论文
共 50 条
  • [31] INHIBITION OF POSITRONIUM FORMATION BY OXALIC-ACID AND OXALATES IN AQUEOUS-SOLUTIONS
    DUPLATRE, G
    ABBE, JC
    MADDOCK, AG
    HAESSLER, A
    RADIATION PHYSICS AND CHEMISTRY, 1978, 11 (05): : 249 - 252
  • [32] Dissolution of nickel ferrite in aqueous solutions containing oxalic acid and ferrous salts
    Figueroa, CA
    Sileo, EF
    Morando, PJ
    Blesa, MA
    JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2000, 225 (02) : 403 - 410
  • [33] COMPLEXATION OF PALLADIUM WITH TIN(II) IN AQUEOUS-SOLUTIONS OF OXALIC-ACID
    ANTONOV, PG
    AGAPOV, IA
    ZHURNAL NEORGANICHESKOI KHIMII, 1989, 34 (06): : 1513 - 1517
  • [34] Carbon nanotube supported platinum catalysts for the ozonation of oxalic acid in aqueous solutions
    Liu, Zheng-Qian
    Ma, Jun
    Cui, Yu-Hong
    CARBON, 2008, 46 (06) : 890 - 897
  • [35] COMPLEXATION OF PLATINUM WITH TIN(II) IN AQUEOUS-SOLUTIONS OF OXALIC-ACID
    ANTONOV, PG
    LUTSKO, TP
    AGAPOV, IA
    KOORDINATSIONNAYA KHIMIYA, 1989, 15 (09): : 1272 - 1277
  • [36] Induction periods during anodic polarization of zinc in aqueous oxalic acid solutions
    Libov, E.
    Lilova, V.
    Girginov, Ch.
    Kozhukharov, S.
    Tsanev, A.
    Yancheva, D.
    MATERIALS CHEMISTRY AND PHYSICS, 2019, 223 : 727 - 736
  • [37] Simulation of adsorption processes on the glass surface in aqueous solutions containing oxalic acid
    Kundin, Julia
    Yu, Chol-Jun
    Conradt, Reinhard
    Emmerich, Heike
    COMPUTATIONAL MATERIALS SCIENCE, 2010, 49 (01) : 88 - 98
  • [38] Investigations on the corrosion of copper patterns in the course of the "post-CMP cleaning" of integrated electronic microcircuits in oxalic acid aqueous solutions
    Bernard, M. C.
    Gabrielli, C.
    Joiret, S.
    Mace, C.
    Ostermann, E.
    Pailleret, A.
    ELECTROCHIMICA ACTA, 2007, 53 (03) : 1325 - 1335
  • [39] STUDIES ON THE ADSORPTION OF AMERICIUM ON ALUMINA FROM AQUEOUS NITRIC ACID OXALIC ACID-SOLUTIONS
    RAO, MS
    GAIKWAD, AM
    RAO, VK
    NATARAJAN, PR
    SEPARATION SCIENCE AND TECHNOLOGY, 1985, 20 (2-3) : 205 - 212
  • [40] The diffusion of copper sulfate in aqueous solutions of sulfuric acid
    Cole, AFW
    Gordon, AR
    JOURNAL OF PHYSICAL CHEMISTRY, 1936, 40 (06): : 733 - 737
12345