The properties of Cu sinter paste for pressure sintering at low temperature

被引：6

作者：

Jo, Jung-Lae ^{[1
]}

Anai, Kei ^{[1
]}

Yamauchi, Sinichi ^{[1
]}

Sakaue, Takahiko ^{[1
]}

机构：

[1] Mitsui Min & Smelting Co Ltd, Mitsui Engn Mat Sect R&D Ctr, 1333-2 Haraichi, Ageo, Saitama, Japan

来源：

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2019年

关键词：

Copper sinter; Power device; Reliability test; Transient heat measurement; Sound acoustic analysis; Thermal cycling test; High temperature storage test; Pressure cooker test; Ag to Cu joint; TO-247; SiC;

D O I：

10.1109/ECTC.2019.00019

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study introduces a newly developed pressure type Cu sinter paste as a joining material substituting for Ag and our investigation into its joining properties and reliability. The Cu sinter paste we developed as a filler by using low temperature sinterable copper particles was able to be sintered at 280 degrees C from 5 to 20 minutes. Pressure was below 10 MPa under N-2 atmosphere. The result of bonding strength showed high shear strength over 50 MPa between the dummy die and Ag/Cu substrate. The cohesive shear modes were shown between the Ag plated layer on the dummy die and Cu paste indicating good enough strength for initial joint reliability. The image of Scanning Acoustic Tomograph also indicated good joining layer with no voids. Ag metallized SiC-SBD and Cu bared TO-247 leadframes were bonded with copper pastes. The sound acoustic analysis was also compared with before and after joint area of Cu paste. Reliability tests showed good performance with these packages. The details will be discussed in this study.

引用

页码：76 / 80

页数：5

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