Microstructure regulation of Sn-3.0Ag-0.5Cu micro-solder joints by hybridizing nano-TiO2

被引：5

作者：

Li, Zhenlong ^{[1
]}

Cheng, Lanxian ^{[2
]}

Li, Guoyuan ^{[3
]}

机构：

[1] Zunyi Med Univ, Zhuhai Campus, Zhuhai 519041, Guangdong, Peoples R China

[2] South China Agr Univ, Coll Elect Engn, Guangzhou 510642, Guangdong, Peoples R China

[3] South China Univ Technol, Sch Elect & Informat Engn, Guangzhou 510641, Guangdong, Peoples R China

来源：

MICROELECTRONICS RELIABILITY | 2022年 / 131卷

基金：

中国国家自然科学基金;

关键词：

Micro-solder joint; Intermetallic growth; Activation energy; Nano-TiO; 2; addition; TIO2; NANOPARTICLES; TENSILE PROPERTIES; IMC GROWTH; LAYERS; SIZE;

D O I：

10.1016/j.microrel.2022.114515

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The intermetallic compound (IMC) formation kinetics of Sn-3.0Ag-0.5Cu micro-solder joints were studied under 100 ?C, 120 ?C, and 150 ?C isothermal aging test. The addition of nano-TiO2 has a great influence on interface reaction, significantly reducing the thickness of IMC. The thickness of IMC layer is able to be regulated by controlling the doping concentration, and the minimum value was achieved with 0.1 wt% doping. The activation energy of IMC formation was approved to be raised after the composite of nano-TiO2, which can further decrease the atomic diffusion rate, and eventually block the overgrowth of IMC. Grain boundary pinning mechanism is regarded as the most important mechanism for inhibiting the growth of IMC because of nano-TiO2 addition.

引用

页数：8

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