Strain Reduction in Silicon-on-Sapphire by Wafer Bonding

被引：0
|
作者：
Imthurn, G. P. [1 ]
Miscione, A. M. [1 ]
Landry, K. [2 ]
Vaufredaz, A. [2 ]
Barge, T. [2 ]
Lagahe-Blanchard, C. [2 ]
机构：
[1] Peregrine Semicond Corp, 9380 Carroll Pk Dr, San Diego, CA 92121 USA
[2] Soitec Parc Technol Fontaine, F-38926 Crolles, France
来源：
2011 IEEE INTERNATIONAL SOI CONFERENCE | 2011年
关键词：
STRESS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页数：2
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