Electrochemical nucleation and growth of poly-N-Methylpyrrole on copper

被引：13
作者：
Raso, M. A. [1 ]
Gonzalez-Tejera, M. J. [1 ]
Carrillo, I. [2 ]
Sanchez de la Blanca, E. [1 ]
Garcia, M. V. [1 ]
Redondo, M. I. [1 ]
机构：
[1] Univ Complutense, Dpt Quim Fis 1, Fac CC Quim, E-28040 Madrid, Spain
[2] Univ Politecn Madrid, Dpt Quim Ind & Polimeros, EUIT Ind, Madrid 28012, Spain
来源：
THIN SOLID FILMS | 2011年 / 519卷 / 08期
关键词：
Poly-N-Methylpyrrole; Electropolymerization; Nucleation electrocrystallization theory; Conducting polymers; COATED STAINLESS-STEEL; CORROSION PROTECTION; POLYPYRROLE COATINGS; BIPOLAR PLATES; MILD-STEEL; MECHANISM; FILMS; POLYANILINE; IRON; ELECTROPOLYMERIZATION;
D O I：
10.1016/j.tsf.2010.11.020
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The potentiostatic electropolymerization of poly-N-Methylpyrrole on Cu at 1.5 V, 2.0 V and 2.5 V vs saturated calomel electrode potentials has been carried out to establish the successive steps of polymer coating generation. The chronoamperograms obtained allow the different steps of the nucleation and growth mechanism to be analyzed by fitting the experimental data to the mathematical equations established in the electrocrystallization theory. In all cases a mechanism consisting of a two-dimensional growth at short time followed by a three-dimensional diffusion controlled growth and at longer times a subsequent two-dimensional growth mechanism, with progressive nucleation, is suggested. Scanning electron microscopy micrographs support this mechanism. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码：2387 / 2392
页数：6
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