Hole drilling of glass substrates with a CO2 laser

被引:26
作者
Ogura, H
Yoshida, Y
机构
[1] Matsushita Elect Ind Co Ltd, Tama Ku, Kanagawa 2148501, Japan
[2] Toyo Univ, Kawagoe, Saitama 3508585, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2003年 / 42卷 / 5A期
关键词
CO2; laser; hole drilling; synthetic quartz; Pyrex glass; soda-lime glass;
D O I
10.1143/JJAP.42.2881
中图分类号
O59 [应用物理学];
学科分类号
摘要
A technique for hole drilling of glass substrates with a pulsed CO2 laser has been developed. With respect to laser machinability, we have compared three application in glass substrates, synthetic quartz, Pyrex glass and soda lime glass for single-laser-pulse (SLP) drilling. Although the drilling speeds for each glass are similar, there is a difference in the occurrence of the pileup around the hole, and we have determined that synthetic quartz is excellent for laser processing. Moreover, we have examined hole processing of synthetic quartz substrates by single and multiple-laser-pulse (MLP) drilling. Consequently, by the MLP hole-shaping technique, we can control the taper angle of a through hole, and decrease the height coefficient of the pileup around the hole in synthetic quartz, which is not possible in SLP drilling.
引用
收藏
页码:2881 / 2886
页数:6
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