Flip chip MPU module on high performance printed circuit board "ALIVH"

被引：0

作者：

Shiraishi, T ^{[1
]}

Amami, K ^{[1
]}

Bessho, Y ^{[1
]}

Sakamaoto, K ^{[1
]}

Eda, K ^{[1
]}

Ishida, T ^{[1
]}

Fukuoka, K ^{[1
]}

机构：

[1] Matsushita Elect Ind Co Ltd, Kadoma, Osaka 5718501, Japan

来源：

1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS | 1998年

关键词：

SBB (TM) technique; ALIVH (TM); MCM (Multi Chip Module); MPU (Micro Processor Unit);

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper describes of a flip chip MPU module on a high performance printed circuit board "ALIVH(TM) (Any Layer Inner Via Hole Structure)" for sub-note PCs using modified SBB(TM) (Stud Bump Bonding) technique. The SBB technique is an advanced flip-chip bonding technique, for high density Multi-Chip-Modules (MCMs), which can mount bare LSI chips directly onto substrates. The structure of bonding portion is composed of Au bumps having two-stepped construction and conductive adhesives. The ALIVH substrate is a high density and high performance multi-layered printed wiring board with any layer inner via hole structure, via hole processing technology using a CO2 laser and interconnection technology that employs conductive paste. In this fabricated MPU module, 4 LSI chips are mounted onto 8 Layered ALIVH substrate and the clock frequency is 160MHz. The weight of it was reduced 40% of the conventional one.

引用

页码：520 / 525

页数：6