Factors affecting the electroless deposition of Ni-Cu-P coatings

Because of the numerous usual and new applications of the electroless amorphous Ni-Cu-P alloys aiming for improvement of Ni-P properties, it is worth achieving adequate empirical modeling of the electroless Ni-Cu-P deposition process. It will enable the estimation of the effect of pH and complexing agents on the deposition rate, phosphorus and copper content. For this purpose, a statistical technique is selected: a full-effect factorial design (FD) of a planned experiment with three factors at two levels of the process variables. This FD experiment allows observation of the effects of each factor at different levels of the other variables, as well as the interactions between these factors. As a result, it was established that the deposition rate and copper content in the alloy are affected the most powerfully by pH and citrate concentration. All obtained regression models include interactions between the variables. (C) 2003 The Electrochemical Society. All rights reserved.