Highly Conductive 3D Printable Materials for 3D Structural Electronics

被引:24
作者
Baker, Daina, V [1 ]
Bao, Chao [2 ]
Kim, Woo Soo [2 ]
机构
[1] Simon Fraser Univ, Sch Sustainable Energy Engn, Surrey, BC V3T 0A3, Canada
[2] Simon Fraser Univ, Sch Mechatron Syst Engn, Surrey, BC V3T 0A3, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
3D printing; structural electronics; 3D printable conductor; printed electronics; conductive ink; conductive filament; COPPER NANOPARTICLES; REDUCTION; INK; MICROFABRICATION; OXIDATION; CIRCUITS; PATTERNS; METALS;
D O I
10.1021/acsaelm.1c00296
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
3D printing will be one of the key technologies in the next industrial revolution. It will usher us into an era of decentralized manufacturing, empowering individuals to manufacture in their communities. One area in particular that can benefit from 3D printing is the production of electronics. 3D printing allows for the fabrication of structural electronics, which have their components embedded in the 3D structured object. Recently spotlighted 3D structural printing technologies include fused filament fabrication and direct-ink writing to prepare 3D conductive traces. Highly conductive traces are imperative for achieving reliable 3D structural electronics. This Spotlight will overview highly conductive 3D printable materials available from several prominent methods of producing conductive traces. Key conducting materials demonstrated by 3D deposition, photocuring, and electrochemical approaches have been reviewed and discussed.
引用
收藏
页码:2423 / 2433
页数:11
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