Advanced Manufacturing of Passive Wireless High-Temperature Pressure Sensor Using 3-D Laser Machining

被引：0

作者：

Yu, Seng Loong ^{[1
]}

Roy, Swadipta ^{[2
]}

Suseela, Sreekala ^{[2
]}

Orekan, Taofeek ^{[2
]}

McConkey, Joshua ^{[2
]}

Soto, Reamonn ^{[2
]}

Rojas-Nastrucci, Eduardo A. ^{[1
]}

机构：

[1] Embry Riddle Aeronaut Univ, Dept Elect Engn & Comp Sci, Daytona Beach, FL 32114 USA

[2] Sensatek Prop Technol Inc, Daytona Beach, FL USA

来源：

2022 IEEE 22ND ANNUAL WIRELESS AND MICROWAVE TECHNOLOGY CONFERENCE (WAMICON) | 2022年

基金：

美国国家科学基金会;

关键词：

Wireless; RF; high temperature; pressure sensor; manufacturing; laser machining;

D O I：

10.1109/WAMICON53991.2022.9786160

中图分类号：

TN [电子技术、通信技术];

学科分类号：

0809 ;

摘要：

Recent radio-frequency resonance-based high-temperature sensors have enable the next generation of passive wireless sensing for harsh environments, such as inside of jet engines. A novel manufacturing technique for an evanescent-mode-resonator-based and antenna-integrated wireless passive pressure sensor is proposed therein. This technique employs a planar PCB manufacturing tool to laser etch a 3-D structure on an alumina substrate. A laser machining study is conducted to find etch consistency and fine-tune laser etching parameters. The wireless passive pressure sensor is tested through various mechanical and thermal loads to measure its performance. The sensor is proven to work in the range of 25 degrees C-1700 degrees C, sensing pressures of 0 psi to 163 psi with resonances within the frequency range of 633 GHz-6.7 GHz.

引用

页数：4

共 8 条

[1] Bruckner G, 2018, IEEE INT ULTRA SYM
[2] Evanescent-mode-resonator-based and antenna-integrated wireless passive pressure sensors for harsh-environment applications
Cheng, Haitao
Shao, Gang
Ebadi, Siamak
Ren, Xinhua
Harris, Kyle
Liu, Jian
Xu, Chengying
An, Linan
Gong, Xun
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 2014, 220 : 22 - 33
[3] A Low-Profile Wireless Passive Temperature Sensor Using Resonator/Antenna Integration Up to 1000°C
Cheng, Haitao
Ebadi, Siamak
Gong, Xun
[J]. IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2012, 11 : 369 - 372
[4] Gong X., 2017, U.S. Patent, Patent No. [9612164B2, 9612164]
[5] MHI Group, MHI ACH 16000 C TURB
[6] Scardelletti MC, 2015, INT CONF WIREL SPAC
[7] Scott S, 2009, IEEE MTT S INT MICR, P1161, DOI 10.1109/MWSYM.2009.5165908
[8] Soto R., 2019, WIPO (PCT) Patent, Patent No. [WO2019100082A1, 2019100082]

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