New manufacturing method for capacitive ultrasonic transducers with monocrystalline membrane

被引：0

作者：

Rey, Patrice ^{[1
]}

Salhi, M. ^{[1
]}

Giroud, S. ^{[1
]}

Robert, P. ^{[1
]}

Lagahe-Blanchard, C. ^{[2
]}

Clatot, S. ^{[3
]}

Ballandras, S. ^{[3
]}

机构：

[1] CEA LETI, 17 Rue Martyrs, F-38054 Grenoble 09, France

[2] TRACIT Technol, F-38054 Grenoble 09, France

[3] FEMTO ST, CNRS, Dept LPMO, UMR 6174, F-25044 Besancon, France

来源：

PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, VOLS 1 AND 2 | 2007年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new method to manufacture Capacitive Micromachined Ultrasonic Transducers (cMUT) combining a wafer bonding and a sacrificial layer processes is introduced. Devices with monocrystalline silicon membranes over a polysilicon electrode have been manufactured. The process is highly reliable and shows an excellent homogeneity all over the 200mm wafer. From impedance measurements in air of a monocell test device biased under 140V, a resonance at 8.0MHz and an electromechanical coupling coefficient of 45% have been found. Underwater pulse-echo experiments are presented demonstrating a large bandwith of the device of about 130%.

引用

页码：111 / +

页数：2

共 4 条

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