Effect of microstructure and grain size on the thermal conductivity of high-pressure-sintered diamond composites

被引：6
|
作者：
Ekimov, E. A. [1 ]
Suetin, N. V. [2 ]
Popovich, A. F. [3 ]
Ralchenko, V. G. [3 ]
Gromnitskaya, E. L. [1 ]
Modenov, V. P. [1 ]
机构：
[1] Russian Acad Sci, Vereshchagin Inst High Pressure Phys, Troitsk 142190, Moscow Oblast, Russia
[2] Moscow MV Lomonosov State Univ, Skobeltsyn Inst Nucl Phys, Moscow 119992, Russia
[3] Russian Acad Sci, Prokhorov Gen Phys Inst, Moscow 119333, Russia
来源：
INORGANIC MATERIALS | 2008年 / 44卷 / 03期
关键词：
D O I：
10.1134/S0020168508030035
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
We have studied the effect of the particle size of diamond (several microns to 500 W) on the thermal conductivity of high-pressure-sintered diamond composites. The results demonstrate that the thermal conductivity of diamond-matrix composites prepared at 8 GPa in the presence of copper rises steeply with increasing diamond particle size, reaching a maximum, 9 W/(cm K), at a particle size of 200-250 mu m. In the case of the samples prepared at 2 GPa and containing isolated diamond grains in a Cu-Ti binder, the grain size has a weaker effect on the thermal conductivity of the material, which can be accounted for by the low thermal conductivity and key microstructural features of the binder.
引用
收藏
页码：224 / 229
页数：6
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