Effect of microstructure and grain size on the thermal conductivity of high-pressure-sintered diamond composites

被引：6

作者：

Ekimov, E. A. ^{[1
]}

Suetin, N. V. ^{[2
]}

Popovich, A. F. ^{[3
]}

Ralchenko, V. G. ^{[3
]}

Gromnitskaya, E. L. ^{[1
]}

Modenov, V. P. ^{[1
]}

机构：

[1] Russian Acad Sci, Vereshchagin Inst High Pressure Phys, Troitsk 142190, Moscow Oblast, Russia

[2] Moscow MV Lomonosov State Univ, Skobeltsyn Inst Nucl Phys, Moscow 119992, Russia

[3] Russian Acad Sci, Prokhorov Gen Phys Inst, Moscow 119333, Russia

来源：

INORGANIC MATERIALS | 2008年 / 44卷 / 03期

关键词：

D O I：

10.1134/S0020168508030035

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We have studied the effect of the particle size of diamond (several microns to 500 W) on the thermal conductivity of high-pressure-sintered diamond composites. The results demonstrate that the thermal conductivity of diamond-matrix composites prepared at 8 GPa in the presence of copper rises steeply with increasing diamond particle size, reaching a maximum, 9 W/(cm K), at a particle size of 200-250 mu m. In the case of the samples prepared at 2 GPa and containing isolated diamond grains in a Cu-Ti binder, the grain size has a weaker effect on the thermal conductivity of the material, which can be accounted for by the low thermal conductivity and key microstructural features of the binder.

引用

页码：224 / 229

页数：6

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